PRINTED CIRCUIT BOARD ASSEMBLY (PCBA)

PCBA

Printed Circuit Board Assembly (PCBA) is the process of attaching electronic components like resistors, capacitors, and integrated circuits onto a Printed Circuit Board (PCB) to create a working electronic device. This can be done using manual tools or automated machines, depending on the complexity and size of the job. PCBA uses two main methods: Surface Mount Technology (SMT), where components are placed directly on the surface of the board, and Through-Hole Technology (THT), where components are inserted into holes on the board and soldered. PCBA is essential in many industries, such as electronics, automotive, aerospace, and telecommunications, and is critical to ensuring the electrical connectivity and functionality of devices like computers, cars, and medical instruments. Quality control and testing are important steps to make sure the assembly works correctly and meets all design requirements.

A) General Part Information

Project Name:-
- Project Name must be added as per new project. (Alphanumeric values are accepted).
Part No.:-
- Part Number which is usually mentioned on the drawing.(Alphanumeric values are accepted).
Annual Volume :-
- Number of Pieces that are Required in a Year. (Limit set for the tool : 1-100000000 Nos).
Batch Qty/Lot Qty:-
- Number of Parts to be Processed in a Single Setup which is automated and calculated as (Limit set for the tool : Annual volume/12).

1b) MANUFACTURING COST ESTIMATION

Heat Staking:-
- Select from the dropdown whether the given process is applicable or not (Yes/ No).
Selective Soldering:-
- Select from the dropdown whether the given process is applicable or not (Yes/ No).
Wave Soldering:-
- Select from the dropdown whether the given process is applicable or not (Yes/ No).
Boundary Scan Test:-
- Select from the dropdown whether the given process is applicable or not (Yes/ No).
Thermal Cycle Test :-
-Select from dropdown whether the given process is applicable or not (Yes/ No).
Conformal Coating + Cure Oven:-
- Select from the dropdown whether the given process is applicable or not (Yes/ No).
Potting/Encapsulation:-
- Select from the dropdown whether the given process is applicable or not (Yes/ No).

B) Bill of Material

No. of Layers:-
- Select layer of PCB from dropdown, if layers are not as per dropdown then user can select nearby layer from the dropdown. (2,4,6,8,10,12,14)
Length of PCB(mm):-
- One of the largest dimension of the PCB.(Limit set for the tool : 0.1mm-200mm).
Width of PCB(mm):-
- One of the shortest dimension of the PCB. (Limit set for the tool : 0.1mm-150mm).
Override No of Holes Count:-
- Enter sum of plated and non plated holes which are shown in the drawing.(If available).
Override Finish Option :-
- Add type of finishing of PCB from dropdown. (Default set to OSP).
Override finish thickness (mm):-
- Select thickness of PCB Finish.
FALSE Organic Solderability Preservative (OSP) Hot Air Solder Leveling (HASL) Electroless Nickel Immersion Gold (ENIG) Immersion Silver (ImAg) Immersion Tin (ImSn)
Min 0.00010 0.00010 0.00001 0.00010 0.00010
Default (mm) 0.00100 0.01000 0.00025 0.00100 0.01000
Max 0.01000 0.10000 0.00100 0.10000 0.10000

C)Overrides

SG&A + Profit (%) :-
- Input percentage of SG&A + Profit as per requirement.